Multilayer boards
100 micron pattern technology
Low CTE with copper-invar-copper or Thermount
Specialists in high performance materials
Resin filled blind and buried vias
Micro blind and buried vias
CAC copperfoil for excellent surface quality
Space and military product approvals
Rigid/Flex boards
High performance constructions
Adhesiveless flex laminates
Space and military product approvals
100 micron pattern technology
Micro blind and buried vias
GF, GFG, GI, BI rigid materials
RF and Mikrowave boards
Full range of PTFE substrates
Active cavities
Dk of 2.1 to 10.0
Space and military product approvals
Multi-gas plasma treatment
100 micron pattern technology
Micro blind and buried vias
Edge plating
Direct die attach
Mixed dielectric hybrids
Data Transfer
Data Media:
E-mail;
3.5 DOS or UNIX tar / bar floppy disc / CD/DVD.
Plot data:
Gerber274X or ODB++ with aperture description contained in the plot file.
One file for each layer, all layers seen from above, same zero point in all layers. Drilling and contour layer must be included.
If the customer have specific requirements regarding dielectric distance, dielectric properties, Cu. thickness etc. these must be specified. Document these with a stack-up drawing on a separate file
(Gerber / HPGL / PCL) or paper sheet.
Products in development
Thermount based constructions with low CTE internal Heat Sinks
HDI PCBs with microvias and RCC foil
Space PCBs for BGA, with soldermask and Ni/Au finish