Capabilities overview:
Double sided
Multilayer
CTE controlled MLB
Blind/buried MLB
Micro via MLB
Impedance controlled MLB (stripline)
Flex, Rigid/Flex
RF and Microwave
Internal Heat sink
External Heat Sink (2D and 3D)
Press-fit service
Specifications/approvals:
IPC 6012 class 2 & 3
MIL-P-55110
MIL-P-50884
ESA-ECSS-Q-70-11C
ESA-PSS-01-710
ESA-CNES-QFT-SP 0117
ESA-CNES-QFT-SP 0119
Materials:
Rigid laminate/prepreg resin systems:
FR4, std. & improved: GF, GFG
BT-Epoxy: GM
Polyimide (glass reinfor.): GI
Thermount® (aramide/polyimide): BI
Arlon 85XT
Microwave materials:
RO3003, RO3006, RO3010, RO3203, RO3210, R4003, RO4350, RT6002, RT6006, RT6010LM, RT5870, RT5880, TMM3, TMM4, TMM6, TMM10 DiClad 527, D522, D870, D880, CuClad 217, C233, C250, AD300, AR320, AR350, AR450, AR600, AR1000, CLTE, 25N, 25FR
Flexible laminate systems:
With adhesive: Butyral based, Acrylic based, Epoxy based
Adhesiveless
All multilayer laminates are specified acc. to IPC-4101 cl II.
Copper Foils:
Printca stocks 12, 17, 35, 70 µ copper foil, all foil is HTE type. (12 is only used with buried / blind vias). To have superior surface quality, CAC foil is used.
Track Width & Insulation:
| Outer layers |
Minimum |
Price optimum |
| Minimal nominal track width |
0.100 mm (12 µ basis Cu.) |
0.125 mm (17 µ basis Cu.) |
| Minimum nominal insulation distance |
0.100 mm (12 µ basis Cu.) |
0.125 mm (17 µ basis Cu.) |
| Inner layers |
|
|
| Minimal nominal track width |
0.100 mm (35 µ basis Cu.) |
0.125 mm (35 µ basis Cu.) |
| Minimum nominal insulation distance |
0.100 mm (35 µ basis Cu.) |
0.125 mm (35 µ basis Cu.) |
Plated Through Holes (PTH):
Minimum mechanical drilled through std. production 0.30 mm
Minimum std. PTH diameter tolerance 0.15 mm (ex: -0.05 mm/+0.1 mm)
Micro vias, drill diameter 0.10 mm, max. depth 0.10 mm.
Annular Ring:
The production tolerance, acc. to IPC-D-275 Printca prod. tol. for 21" panels;
| |
Outer layer |
Inner layer |
| Double sided PCBs |
+0.20 mm |
NA |
| Multilayer, drilled through holes |
+0.20 mm |
+0.30 mm |
| Buried vias, two-layers |
NA |
+0.40 mm |
| Blind vias, two-layers |
+0.35 mm |
+0.40 mm |
| Blind or buried vias between several layers |
+0.35 mm |
+0.60 mm |
| Multilayer with flexible inner layers |
+0.20 mm |
+0.60 mm |
Printca prod. tol. for 18" panels:
| |
Outer Layers |
Inner Layer |
| Double sided PCBs |
+0.17 mm |
NA |
| Multilayer, drilled through holes |
+0.17 mm |
+0.25 mm |
| Buried vias, two-layers |
NA |
+0.35 mm |
| Blind vias, two-layers |
+0.32 mm |
+0.35 mm |
| Blind or buried vias between several layers |
+0.32 mm |
+0.55 mm |
| Multilayer with flexible inner layers |
+0.17 mm |
+0.55 mm |
Finishes:
Electroless Nickel/Immersion Gold (99.9% Gold)
HAL (Eutectic 63% Tin - 37% Lead)
Reflowed Tin/lead
Nickel - Hard Gold
Nickel - Soft Gold
Organic Solderability Preservative (OSP)
Chemical Tin
Solder-Masks:
Wetfilm 20 µ
Dryfilm 50 µ, 75 5 µ or 100 µ
Two-pack epoxy 100 µ.
Notation
Peel-off mask
Controlled Impedance:
Impedance Test
Actual Impedance will be measured via the TDR (Time Domain Reflectometry) method.
Representative test coupons will be auto generated by Printca.
Packing Methods:
20 different from industrial to HiRel.
Bar-code labels is possible.
Recommendations for pre baking of PCBs before soldering:
Rigid and Rigid/Flex PCBs FR-4 and Polyimide:
PCBs up to 1.0 mm thickness: minimum 2 hours at 120° C
PCBs up to 1.8 mm thickness: minimum 4 hours at 120° C
PCBs up to 4.0 mm thickness: minimum 6 hours at 120° C
Rigid and Rigid/Flex PCBs with Polyimide/Thermount®:
All PCB thicknesses: minimum 6 hours at 135° C
Dwell time between baking and soldering is depending on the storage conditions.
At 50 % relative moisture the recommended time is max. 8 hours.
After baking the PCBs can be kept in vacuum or in an oven at 35°C, which will increase the dwell time.
Quality Assurance
ISO 9001:2008
AQAP 2120